Atomic Layer Deposition
Atomic Layer Deposition (ALD) is an advanced thin-film deposition technology based on self-limiting surface reactions, which enables atomic-scale thickness control, exceptional film uniformity, and perfect 3D conformality. This technology is particularly suitable for the preparation of high-performance nanoscale coatings for lithium batteries, semiconductors, and photovoltaics.
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Working Principles
The fluidized bed coating machine utilizes two-phase flow jet technology to atomize the coating liquid into fine droplets via high-pressure gas. These droplets then collide and interact with fluidized powder particles, achieving uniform and controllable micro-nano functional coating.
Product Advantages
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High Coverage100% step coverage (for high aspect-ratio structures). -
Significant EffectFilm thickness shows linear dependence on cycle number. -
Low-temperature ProcessLow-temperature process compatibility (350℃). -
Special FunctionsFunctional materials such as Al₂O₃, LiPON, TiO₂, HfO₂, and ZnO can be deposited.
Applicable Fields
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Electronics & Semiconductor IndustryHigh-k Oxides (HfO₂, Al₂O₃) Metal Nitrides (TiN, TaN) Noble Metals (Ru, Ir)
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New Energy IndustryMetal Oxides (Al₂O₃, TiO₂, ZrO₂) Lithium Compounds (Li₃PO₄, LiAlO₂) Fluorides (AlF₃)
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New Materials IndustryFluorides: AlF₃, LiAlF₄ (Battery Protection) Sulfides: MoS₂, WS₂ (2D Materials, Catalysis) Carbon-based: Diamond-Like Carbon (DLC), Graphene Composite Films
Applicable Materials
Powder Materials
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